PCB Design & Assembly for Sub-2 K Magnetic Measurements

I have designed and assembled PCBs for low-temperature (<2 K) magnetic measurements.

Careful orientation of in-plane (IP) and out-of-plane (OOP) samples, coaxial cable routing, and current pad layout for high-precision experiments.
Creating SMP port and pin footprints
4-layer design for DC lines connections using pads, via and pins
Assembly steps: SMP port integration, CPW and resonator chip mounting using conductive silver paint, and curing for stable low-temperature operation.

PCB design layout for sub-2 K measurements

IP PCB with mounted resonator chip with conductive silver paint

PCB layout, chip mounting, and SMP port integration for high-fidelity low-temperature (Sub-2 K) magnetic measurements.

Key Steps & Techniques

Altium

PCB Design: Layout for current application pads and coax routing optimized for low-temperature operation. (Designed using: Altium Designer)
Sample Orientation: In-plane (IP) and out-of-plane (OOP) mounting for magnetic characterization.
Chip Assembly: CPW and resonator chips mounted with conductive silver paint, followed by curing in a vacuum oven.
Connector Integration: SMP ports soldered using solder paste for robust RF connections.
Sub-2 K Measurement Preparation: Assembled boards are compatible with cryogenic measurement setups for magnetic samples.

YIG sphere placed on a PCB assembly for low-temperature testing

Coaxial cable used for microwave measurements

Final assembly with an YIG sphere (Left), the coaxial cables (Right), ready for sub-2 K magnetic characterization experiments.

Demonstrated precision PCB assembly techniques for low-temperature magnetic experiments, combining RF design, mechanical mounting, packaging and cryogenic compatibility.